JPH0311904Y2 - - Google Patents

Info

Publication number
JPH0311904Y2
JPH0311904Y2 JP1983186012U JP18601283U JPH0311904Y2 JP H0311904 Y2 JPH0311904 Y2 JP H0311904Y2 JP 1983186012 U JP1983186012 U JP 1983186012U JP 18601283 U JP18601283 U JP 18601283U JP H0311904 Y2 JPH0311904 Y2 JP H0311904Y2
Authority
JP
Japan
Prior art keywords
conductive
layer
hole
plating
paint layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983186012U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6094868U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18601283U priority Critical patent/JPS6094868U/ja
Publication of JPS6094868U publication Critical patent/JPS6094868U/ja
Application granted granted Critical
Publication of JPH0311904Y2 publication Critical patent/JPH0311904Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP18601283U 1983-12-01 1983-12-01 電子回路用基板 Granted JPS6094868U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18601283U JPS6094868U (ja) 1983-12-01 1983-12-01 電子回路用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18601283U JPS6094868U (ja) 1983-12-01 1983-12-01 電子回路用基板

Publications (2)

Publication Number Publication Date
JPS6094868U JPS6094868U (ja) 1985-06-28
JPH0311904Y2 true JPH0311904Y2 (en]) 1991-03-20

Family

ID=30401899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18601283U Granted JPS6094868U (ja) 1983-12-01 1983-12-01 電子回路用基板

Country Status (1)

Country Link
JP (1) JPS6094868U (en])

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519143A (en) * 1974-07-15 1976-01-24 Matsushita Electric Works Ltd Netsukasoseijushitairumoyotsukeyo chitsupuseikeihoho
JPS5247824A (en) * 1975-10-15 1977-04-16 Hodogaya Chem Co Ltd Method for solubilizing copper phthalocyanine dyes into hydrocarbon so lvents
JPS5544398U (en]) * 1979-10-04 1980-03-22
JPS5874097A (ja) * 1981-10-29 1983-05-04 松下電器産業株式会社 印刷配線板の製造方法

Also Published As

Publication number Publication date
JPS6094868U (ja) 1985-06-28

Similar Documents

Publication Publication Date Title
US3391455A (en) Method for making printed circuit boards
KR20020040597A (ko) 전자 장치용 적층 구조체 및 무전해 금도금 방법
KR100393271B1 (ko) 다층 전자부품탑재용 기판의 제조 방법
JPH0311904Y2 (en])
JP7307303B2 (ja) 多層基板及び部品実装基板、並びに、それらの製造方法
JP3735873B2 (ja) プリント配線板
JPH04144190A (ja) 配線基板およびその製造方法
JPH10340625A (ja) 導電性ペーストおよびその製造方法およびそれを用いたプリント配線基板
JPH0311903Y2 (en])
JPH0317237B2 (en])
JPH0261160B2 (en])
JP2774183B2 (ja) 電磁シールドプリント基板の製造方法
JP3827407B2 (ja) 半導体搭載用基板
JP2002299826A (ja) 多層プリント配線基板、半導体装置、及び、これらの製造方法
JPH1074859A (ja) Ｑｆｎ半導体パッケージ
JPS648478B2 (en])
JPS639396B2 (en])
JPH04133492A (ja) 印刷配線板の製造方法
JPS6355236B2 (en])
JP2819560B2 (ja) 配線基板及びその製造方法
JP3922995B2 (ja) 半導体実装用プリント配線板およびその製造方法
JPS5826839B2 (ja) 印刷配線板
JPH10150259A (ja) 部品付きプリント配線板およびその製造方法
JPH11354911A (ja) フレキシブル回路基板の製造方法
JPS6031116B2 (ja) 電気配線回路基板およびその製造方法